Signal Integrity

On High Speed Digital Chip-to-Chip Links

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Entries Tagged as 'IEEE'

Visit the Agilent at Electrical Performance of Electronic Packaging

October 3rd, 2008 · No Comments · Conference

Visit the Agilent EEsof EDA exhibit at Electrical Performance of Electronic Packaging 2008 conference.

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Fast-Approaching Deadlines for DesignCon and MTT

July 28th, 2008 · No Comments · Conference

The submission deadlines for DesignCon 2009 and International Microwave Symposium 2009 are approaching.

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MTT Workshop “Demystifying Microwave Signal Integrity”

May 28th, 2008 · No Comments · Workshop

Mike Resso will present a paper “Datamining 12 port S-parameters for Backplane Analysis.”

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