Signal Integrity

On High Speed Digital Chip-to-Chip Links

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Entries Tagged as 'Technical Paper'

Solving PCB Fiber Weave Issues

January 6th, 2011 · No Comments · Technical Paper

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‘Practical Fiber Weave Effect Modeling’ white paper from Bert Simonovich

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Accelerate Flex Circuit Simulation with Multilayer Interconnect Models

March 22nd, 2010 · No Comments · Technical Paper

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DesignCon 2010 paper by Jim Nadolny, Senior SI/EMI Engineer at SAMTEC, Shielded Flex Circuitry – What Drives Performance?

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